MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Ag Nanowire and Nanoplate Composite Paste for Low Temperature Bonding
Ruo-Zhou LiTong ZhangAnming HuDenzel Bridges
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JOURNAL FREE ACCESS

2015 Volume 56 Issue 7 Pages 984-987

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Abstract

Nanopastes based on noble metals for low temperature bonding are currently of great interest. We have developed Ag nanowire and nanoplate composite paste. Copper-copper joining has been achieved using solid state sintering of nanopastes. We show that an enhanced bonding strength can be achieved by integrating Ag nanoplates into Ag nanowire pastes. Ag nanowire and nanoplate composite pastes are capable of being a low-temperature interconnect material potentially for interconnection in lead-free microcircuits, flexible electronic packaging and sensing applications.

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© 2015 The Japan Institute of Metals and Materials
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