MATERIALS TRANSACTIONS
Copper-Based Nanostructured Coatings for Low-Temperature Brazing Applications
Benjamin LehmertJolanta Janczak-RuschGiancarlo PigozziPeter ZurawFabio La MattinaLukas WojarskiWolfgang TillmannLars P. H. Jeurgens
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Volume 56 (2015) Issue 7 Pages 1015-1018

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Abstract

This feasibility study demonstrates the possibility to apply nanostructured filler materials for novel low-temperature brazing applications by exploiting the size-dependent melting behavior of metals and alloys when confined to the nano-scale regime. As an example, a copper-based nanostructured brazing filler is presented, which allows metal brazing of coated Ti-6Al-4V components at 750°C, much below the bulk melting point of copper (1083°C). The copper-based nanostructured brazing fillers can be produced in the form of coatings and free-standing brazing foils. The nano-confinement of Cu is abrogated after brazing and, consequently, the brazed joints can be operated well above their reduced brazing temperatures.

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© 2015 The Japan Institute of Metals and Materials
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