Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin–Lead Solder on “Surface Fine Crevice Structure”

Abstract

Previously, a “surface fine crevice structure” on a copper plate was created by laser irradiation and was found by the authors to be suitable for “unusual wetting”. Copper plates with “surface fine crevice structure” were joined by an unusual wetting phenomenon using liquid bismuth as joining material. In this study, we examined the viability of using tin and a tin–37 mass% lead solder as joining materials by focusing on intermetallic compound formation with copper. The wettability of the “surface fine crevice structure” on a copper plate by liquid tin and tin–lead solder was investigated and joint experiments were performed using two copper plates. The successful wetting of tin and solder material on the “surface fine crevice structure” of copper and the joining of copper plates was confirmed despite the formation of intermetallic compounds.