Change in Electrical Resistivity in Nickel Processed by Accumulative Roll Bonding

Abstract

Pure nickel was processed by accumulative roll bonding (ARB), and the change in electrical resistivity measured at 77 K was about 2.2 nΩm after 8 ARB cycles. The change in electrical resistivity was estimated based on the microstructural parameters, such as, dislocation density of about 3 × 10¹⁴ m⁻² and density of grain boundaries of about 8 Mm⁻¹ after 8 ARB cycles. Those values were evaluated using X-ray diffraction and electron backscattering diffraction in a field emission-scanning electron microscope, respectively. The change in the electrical resistivity was associated with the above-mentioned microstructural parameters.

Fig. 3 Change in electrical resistivity at 77 K with increasing number of ARB cycle. Increment of electrical resistivity at 77 K from ARB 0c is displayed as right axis. The dashed line is the guide of eyes.