MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Electrical Resistivity and Morphology of Sn1−x/Six Core–Shell Cluster Network Prepared by a Plasma-Gas-Condensation Cluster Source
Yuichiro KurokawaTakehiko HiharaKenji Sumiyama
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JOURNALS FREE ACCESS Advance online publication

Article ID: M2012232

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Abstract

Sn1−x/Six cluster assembled films have been prepared by a plasma-gas-condensation cluster beam deposition apparatus. Transmission electron microscope images indicate that individual clusters have core–shell morphology, where Sn cores are covered by Si shells. Temperature dependence of electrical resistivity exhibits a metallic behavior and a superconducting transition at low temperature for 0 < x < 0.20, while a semiconductor-type behavior and no superconductivity down to 2 K for x > 0.29. These results indicate that the cluster network and/or core–shell morphology Sn1−x/Six cluster assembled films changes with x.

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© 2012 The Japan Institute of Metals and Materials
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