Characterization of Al/Ti Nano Multilayer as a Jointing Material at the Interface between Cu and Al₂O₃

Abstract

In this paper, a series of Al/Ti multilayers with different modulation periods were used in copper and Al₂O₃ ceramic diffusion bonding. The reactive multilayer was deposited by DC magnetron sputtering, and the diffusion bonding experiments were performed at 900℃ for 10 min with a pressure of 5 MPa. The interfacial joints were inspected by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction and tensile shear tests. As a result, no significant metallurgical defect was observed in the microstructures of the joints. The formation of several intermetallic compounds at the interface, such as Cu/Ti eutectic and Al₂O_3-X·TiO compound, has further confirmed the success of Cu-Al₂O₃ bonding as compared to the Al/Ni nano-multilayers, which use Al/Ti nano-foils as interlayer for diffusion bonding to bring more benefit to the quality of cermet joint.