ITE Transactions on Media Technology and Applications
Online ISSN : 2186-7364
ISSN-L : 2186-7364
Special Section on Advanced Image Sensor Technology
[Paper] 3D Stacked Imager featuring Inductive Coupling Channels for High Speed/Low-Noise Image Transfer
Masayuki IkebeDaisuke UchidaYasuhiro TakeMakito SomeyaSatoshi ChikudaKento MatsuyamaTetsuya AsaiTadahiro KurodaMasato Motomura
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2016 Volume 4 Issue 2 Pages 142-148


This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, we also worked on resolving another throughput-limiter, namely power consuming Time to Digital Converter (TDC) used in column parallel ADCs. Novel intermittent TDC operation scheme presented in this paper can reduce its power dissipation 57% from conventional ones.

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© 2016 The Institute of Image Information and Television Engineers
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