グラビア製版に関する研究
各種腐食液の酸化還元電位について
1970 年 11 巻 4 号 p. 83-89
詳細
1970 年 11 巻 4 号 p. 83-89
We studied on redox potential of various gravure etching solution (mainly FeCl3 aq. solution) and the change in redox potential when etching solution penetrates into the resist and etches copper plate.
The results are,
1) Redox potential of etching solution varies with concentration of FeCl3.
2) With etching solution containing copper powder, it is observed that redox potential falls as much as 100mV with the addition of 2g/l of copper powder. When the solution passes through a resist, no outstanding peak appears in the change of potential.
3) With etching solution containing a metal salt, redox potential is generally higher than that with additive-free solution.
4) Observing the change in redox potential when etching solution penetrates and etches copper plate after passing through a resist, it is generally noted that the potential increases suddenly as it reaches the surface of the copper plate and falls with the start of etching. This change in potential is especially remarkable when such agent as NaCl, CaCl2 MgCl2 and LiCl are added to the solution.
