Nogaku Open Access Journal
Online ISSN : 2436-3987
Determination of the specific heat capacities of several common wood adhesives cured in bulk form using differential scanning calorimetry
Wataru TAKADATakashi TANAKA
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JOURNAL OPEN ACCESS

2021 Volume 1 Issue 1 Pages 1-6

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Abstract

The purpose of this study was to derive the specific heat capacities of several representative wood adhesives as a function of temperature. Phenolic resin adhesives, urea resin adhesives, melamine-urea co-condensation resin adhesives, water-based polymer-isocyanate adhesives, resorcinol resin adhesives, and one-component polyurethane adhesives were prepared and cured as per the manufacturer's recommended instructions to obtain bulk cured products of each adhesive. The specific heat of each adhesive was measured every 10 °C in the range of -20 °C to 60 °C using a differential scanning calorimeter; the temperature range selected was wider than that experienced in day-to-day life.

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この記事はクリエイティブ・コモンズ [表示 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by/4.0/deed.ja
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