Changes in gate threshold voltage (VT), carrier mobility (μ), and low-frequency-noise characteristics have been investigated for n-channel MOSFET's, into whose channel region 11B+, 27Al+, 28Si+ and 31P+ ions were implanted through their gate oxide film.
In case of Si implantation, a slight decrease in μ still remained after 15min. anneal at 950°C, while no significant change was observed in VT or in noise characteristics. Introduction of acceptor ions resulted in a substantial decrease in μ, and an increase in low-frequency noise level. The shift in VT was found to be proportional to implantation dose up to 1012 cm-2 in case of B+ and P+ implantation.
It is possible to detect the effct of radiation damages from the changes in VT of MOS-FET's. From the annealing behavior of Si+ implanted MOSFET, the activation energy of annihilation of such radiation damages was obtained to be 0.35 eV.