Films by thermal decomposition of organic tin compounds, were deposited on ceramic substrates. Using these films, the authors produced film resistors. In order to investigate the characteristics of these films, physical and electrical measurements were performed.
From the investigation of X-ray diffraction patterns and electron micrographs, it was found that films produced at a comparatively low temperature consist of tin oxide and amor-phous carbon and films produced at a higher temperature consist of tin and carbon like graphite. Depending on the characteristics of the tin and carbon complex film resistor, it is possible to increase sheet resistivity without impairing, the electrical properties of the carbon film resistor. Moreover the various electrical properties of the complex films, in which the sheet resistivity is under a few kΩ/sq., are more satisfactory as compared with the carbon film resistor.