1983 年 52 巻 7 号 p. 626-630
A pair of control electrodes between which an AC control voltage can be applied is inserted into the positive column between the target and the substrate holder in order to control the target current of DC diode sputtering systems. By this means the target current can be kept constant within a deviation of ±2% for even such a large pressure change as from 2.7 to 5.3 Pa. This method has been applied to the deposition of Ta films, and electrical properties of the films were investigated. Deposition rates were found to be independent of control voltages. Although specific resistivities and temperature coefficients of resistance were slightly affected by control voltages, the effect was negligible for the applied voltages between 30 and 130 V. This method is found to be very effective for massproduction inline systems combined with a rough pressure control system.