The Design of Photosensitive Polyimide Materials for Buffer Coating Processes

Abstract

The reasons for the use of photosensitive polyimides (PSPIs) in semiconductor buffer coating processes and the technical problems associated with such materials have been widely described. The requirements for the further improvement of the pre-established processes and the considerations affecting the design of future PSPI materials are discussed. The next generation of PSPI buffer coating processes is briefly described.