Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
Plasma-induced Damages to Polyimide Diaphragms during Si Dry-etching in Micropump Fabrication Processes
Yingwei Liu, Hiroki Komatsuzaki, Ryuta Ikoma, Yasuhiro Nishioka
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Keywords: Non-flammability, Poly(ester imide)s, Low-modulus polyimides, Phosphorus-containing monomers, Copper clad laminates, Cover layers, Flexible printed circuit boards
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Volume 24 (2011) Issue 3 Pages 293-298

DOI https://doi.org/10.2494/photopolymer.24.293
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© 2011 The Society of Photopolymer Science and Technology (SPST)
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