Pattern Size Effects on Demolding Force for Imprint Process

Abstract

The demplding forces for thermal imprint to polystyrene film are studied. Two molds with 0.4 μm and 4 μm pitch LS patterns are fabricated. The pattern heights are adjusted in order to keep the side wall areas of both the molds same. The demolding force for the 0.4 μm mold is much smaller than that for the 4 μm mold. The pattern height rather than the side wall area is important factor for the demolding force. The demolding force is increased by the UV/O₃ treatment. The effect is more obvious for the 0.4 μm mold than for the 4 μm mold, because the pattern density of the 0.4μμm mold is larger than that of the 4 μm