Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Analysis of the Metal/Polymer Bi-layer Structure during Demolding Process of Nanoimprinting
Qing WangXu ZhengRui ZhangJintao ZhangLijun MaHuawei Liu
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2015 Volume 28 Issue 6 Pages 763-767

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Abstract

Nanoimprinting has become one of the advanced patterning methods for fabricating metal/polymer bi-layer nanostructures used for functional materials. How to control and avoid the emergence of various defects in nanoimprinting process is one of the key issues to improve the quality of nanofabrication. However, little attention has been paid to the demolding process which most likely lead to defects. In this paper, von Mises stress and deformation of bi-layer structure during demolding process were simulated and analyzed. In the finite element analysis model, the adhesion and friction forces were considered. The results presented that stress concentration occurred at four locations in the bi-layer structure. The curves of stresses were plotted to explain the stress concentration and deformation. By comparing the stresses at key locations, related regularities about how to avoid stress concentration were proposed. Depending on these regularities, corresponding measures can be applied to avoid the delamination defects in bi-layer structure in practice.

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© 2015 The Society of Photopolymer Science and Technology (SPST)
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