Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Advanced Formulation for DSA Resists
Celia NicoletXavier ChevalierJulien BeausoleilKaumba SakavuyiJohn BerronNick BrakensiekDarron JurajdaChristophe NavarroIan Cayrefourcq
Author information
JOURNALS FREE ACCESS

2016 Volume 29 Issue 5 Pages 671-674

Details
Abstract

Arkema has developed two complementary strategies to enable early introduction of DSA technology into lithographic large nodes. The blend approach is a very powerful way to easily tune the reachable period. Special BCPs and blends enable to increase achievable BCP film thicknesses and to limit the defectivity leading to improved self-assembly's properties. Special BCPs specially prove dramatic improvement in the self-assembled features as regards to classical PS-b-PMMA systems of same dimension. Additionally, the processes for both of these systems are compatible with current end users' requirements.

Information related to the author
© 2016 The Society of Photopolymer Science and Technology (SPST)
Previous article Next article
feedback
Top