Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Analysis of Resist Removal Phenomenon Using Laser Irradiation
Tomosumi KamimuraHirouki KuramaeTakayuki YamashiroKosuke NunoYuji UmedaSingo TsujimotoRyosuke NakamuraTakashi NishiyamaHideo Horibe
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2017 Volume 30 Issue 3 Pages 291-295


Resist removal phenomenon with laser irradiation was analyzed by using a finite element (FE) method. Laser irradiation in the water can improve the resist removal effect as compared with that of normal atmosphere irradiation. A two-dimensional (2-D) micro-FE model was constructed based on the boundary surface between the Si wafer, resist and water during laser radiation. In the normal atmosphere, any effective stress did not occur along the x-axis direction in the resist. In contrast, for the laser irradiation in the water, large compressive stress was confirmed along the x-axis direction in the resist. This compressive stress in the resist is thought to improve the resist removal efficiency.

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© 2017 The Society of Photopolymer Science and Technology (SPST)
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