2018 Volume 31 Issue 5 Pages 629-632
We successfully developed redistribution structure by using photosensitive polyimide and all wet Cu plating processes. To obtain the structure, patterned Cu was obtained by non-electrical plating on photosensitive polyimide layer with a mask of photo-resist. Various types of surface treatments on polyimide layer were investigated to obtain good adhesion between Cu and polyimide. In this work, we coated the photosensitive polyimide by a slit coater and found a suitable wet surface treatment to obtain good adhesion to plated Cu. The all wet Cu processes are composed of wet activation process and electro-Cu plating process. By combining all these processes, 40μm line and space Cu pattern was obtained by using a 500-600 mm glass panel. In addition, 2μm line and space Cu pattern was obtained on an 8 inch glass wafer.