Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : F33
Conference information

Host: The Japan Society for Precision Engineering

Improvement of Thickness Measurement Accuracy of Silicon Wafer Using Three-Point-Support Inverting Method
*Yukihiro Ito, Wataru Natsu, Masanori Kunieda
Author information
Keywords: Nano shape measurement, Silicon wafer, Thickness, Deflection, Stiffness constant
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (214K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2008 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top