Proceedings of JSPE Semestrial Meeting
2009 JSPE Spring Conference
Session ID : L38
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Host: The Japan Society for Precision Engineering

Study on Multi-wire Saw Using Diamond Slurry
Relationship between Slicing Characteristics and Diamond Grains or Base oil
*Keiji Tsunokawa, Tomohisa Ueno, Hitoshi Suwabe, Ken-ichi Ishikawa
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Keywords: Lapping, Slicing, Multi-wire saw, Diamond slurry
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[in Japanese]
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© 2009 The Japan Society for Precision Engineering
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