Proceedings of JSPE Semestrial Meeting
2010 JSPE Autumn (Spring) Conference
Session ID : C14
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Development and evaluation of small-sized ultrasonic impact machining device
*Masashi NishiharaShizuichi HiguchiHideo KatouKazuya Okawa
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Abstract
In this paper, small-sized ultrasonic impact machining device without using loose grain has been developed, aiming at the reduction of the cost, miniaturization and the simplification of the device, and investigation of the machining possibilities of this method. In this study, experiments of machining glass work pieces were carried out. In the experiments, a diamond tool vibrated with high frequency was pressed directly on the glass workpieces during a machining process. As a result of this study, effects of the machining conditions such as static load and amplitude of tool, feed rate on the machining characteristics were clarified.
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© 2010 The Japan Society for Precision Engineering
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