Host: The Japan Society for Precision Engineering
Name : 2025 JSPE Spring Conference
Location : [in Japanese]
Date : March 17, 2025 - March 19, 2025
Pages 587-588
Next generation ultrasound cleaning technology is effective in removing fine stains, and in recent years, its application to cleaning silicon wafers has attracted significant attention. To achieve high-efficiency cleaning without causing defects on the silicon wafer surface, it is necessary to drive at a high frequency band with a high cavitation threshold. However, current ultrasonic cleaning devices face challenges, such as the difficulty of performing cleaning at frequencies above the MHz range. In this study, high-power operation in the MHz range was achieved by focusing ultrasound with parabolic reflection surface.