Interfacial Contact Process Controlled by Superplastic Flow in Solid-state Bonding of Superplastic High Carbon Steel

抄録

The solid state bonding of fine-grained high carbon steel was carried out and the interfacial contacting mechanisms were experimentally investigated. It was found that superplastic deformation played a dominant role in the interfacial contacting process from a bonding ratio of 30% to 40%, under the bonding conditions of bonding temperature T = 1023∼1053K and bonding pressure P = 35∼45MPa. The stress exponent, n, was about 2.5 while the activation energy, Q, was about 151 kJmol^-1. Predominant bonding mechanism controlled by superplastic flow was reproduced in the early bonding stage, under the conditions of T = 1023∼1053K and P = 35∼45MPa.