Abstract
The weldability of dispersion hardening alloys must be made clear in order to use them in various industries. Especially, on the point of practical use, it is very important to increase the joint efficiency.
So, in this report, the disappearance of voids and the behavior of ThO2 particles at the bonding interface were discussed as the first step of applying the solid state bonding to the dispersion hardening alloys.
The main results obtained are summarized as follows;
(1) The disappearance of voids is mainly accelerated by the local creep deformation. The mechanical deformation at the bonding interface is an important process for the solid state bonding.
(2) The disappearance phenomena of voids and the behavior of ThO2 particles at the bonding interface were metallurgically investigated. The authors indicated the temperature-time region which was useful to etermine the solid state bonding conditions of TD nickel.
