QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
Print ISSN : 0288-4771
Joining Process and the Effect of Surface Finishing in Soldering Aluminum with the Aid of Ultrasonic Vibration
Soldering Aluminum with the Aid of Ultrasonic Vibration (2nd Report)
Takehiko WatanabeYuichi TanakaAtsushi YanagisawaShizuyo OnumaShoichi Sato
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1992 Volume 10 Issue 4 Pages 476-483

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Abstract

We have been studying on soldering aluminum with the aid of ultrasonic vibration. In the previous paper, the effects of ultrasonic vibration, joining temperature and pressure on the properties of the joint were examined.
In this paper, the effects of faying surface roughness and filler metal thickness on the joint properties were investigated. Furthermore, we discussed the joining process of this soldering method and referred the corrosion resistance of the joint.
The Paying surface roughness and a polishing paper influenced considerably on the joint strength. Especially, when the polishing emery paper of # 1500 was used the SiC particle, which was the main component of the emery paper, was caught in the polished surface and caused the joint strength to decrease. The thickness of the filler metal also had much influence on the strength of the joint soldered at relatively low temperature. The strength was decreased with the filler metal thickness.
The corrosion test revealed that the eutectic microstructure in the soldered part had low resistance to corrosion, and that the corrosion resistance increased with the increase of Al-solid solution volume in the microstructure.
Referring to the joining process of this soldering method, it was known that the eutectic liquid formed at the Paying interface played the roles of not only wetting and bonding but also putting broken oxide films out of the interface.

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