Cu板上のSn-Pb合金のぬれ先端の界面構造
Cu板上のSn-Pb合金のぬれ(第1報)
1993 年 11 巻 3 号 p. 401-404
詳細
1993 年 11 巻 3 号 p. 401-404
In order to make clear the mechanism of wetting and to treat it quantitatively, we tried to reveal the interface structure at advancing edge of Sn-Pb alloy droplet on Cu plate.
Liquid droplet of alloy on a Cu plate was blown off by high speed Ar gas heated to a temperature of about 475 K, and concentrations of elements along the vertical cross section of interface were measured using AES analyser scraping by Ar sputtering.
The results showed that Sn enrichment was formed at the interface immediately after melted down of alloy and the most outside edge of halo was Sn only.
The experiment method used proved to be a useful method for the analyse of interface between liquid and solid.
