溶接学会論文集
Print ISSN : 0288-4771
熱伝導シミュレーションによる接合部の欠陥検出条件及び検出限界寸法の検討
レーザ照射型熱画像法によるマイクロ接合部欠陥検出に関する研究(第2報)
岩田 剛治仲田 周次
著者情報
ジャーナル フリー

1993 年 11 巻 4 号 p. 515-519

詳細
抄録

The position and size of internal defect, optimal detection condition and minimum defect size on the inspection are investigated on the computer simulation on thermal model of the joint.
The size and position of internal defect can be determined by the area of temperature above Tc on the joint surface, and then optimal detection condition (laser power, taking time of thermal image) are decided by the relation between temperature behavior of the joint under laser irradiation and characteristics of thermography.
Furthermore, minimum defect size on the inspection is influenced by kinds, thickness of the lead and thermal transfer coefficient at the interface of the joint, and is nearly 50, urn in the case of the micro joint between cepper alloy lead with 150μm thickness and glass epoxy substrates (1.6 mm thickness).

著者関連情報
© 一般社団法人 溶接学会
前の記事 次の記事
feedback
Top