Niめっき条件と接合品質との関連性
母材のめっきがマイクロ接合品質に及ぼす影響
1994 年 12 巻 4 号 p. 582-587
詳細
1994 年 12 巻 4 号 p. 582-587
Plarallel gap resistance welding of Ag plated 0.18mm diameter oxygen free copper wires to Au+ Ni plated of Printed circuit boards (P/B) was investigated (Concerning Ni Plating). The results are summarized as follows.
(1) Fracture for watt's bath Ni plating circuit board after tensile strength test is Ductile fracture surface.
(2) Fracture for Sulfamate Ni plating Circuit board is Brittle fracture surface.
(3) Sulfamate Ni plating cause to Brittle fracture surface, by the reason of heating 500°C [773 K] (Tensil strength and Elongatio value decrease).
(4) The origin of Brittle fracture is Sulfur (After heating 500°C [773 K] Sulfur of fine precipitates growth in grain boundary).
(5) When Sulfamate Ni plating of electrical parts is used in heating process, we must take care of use.
