細線とはんだめっき印刷回路板とのパラレルギャップマイクロ接合の信頼性
1994 年 12 巻 4 号 p. 591-599
詳細
1994 年 12 巻 4 号 p. 591-599
Parallel gap resistance welding of Ag plated 0.18 mm, 0.26 mm diameter oxygen free copper wires to solder plated printed circuit boards (Edge card for computer tape cable) was investigated.
The Results are summarized as follows
(1) Optimum welding condition was estabilished (gap of electrode, electrode wear and weld voltage).
(2) Computer's tape cables have been produced by Automatic tape cable assemble line was producted computer's tape calbe.
(3) Developed welding method gave sataisfactory results (5×108 weld points for 20 years were no trouble).
(4) Quality control of parallel gap was estabilished (Purchasing parts Inspection, manufacturing quality control, improvent activites, shipment quality).
