溶接学会論文集
Print ISSN : 0288-4771
TCPリードの金錫接合部の強度特性
LSIリードフレーム材料の接続に関する研究(第4報)
御田 護熊倉 豊彦
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ジャーナル フリー

1997 年 15 巻 2 号 p. 376-382

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This report considers the low melting point Au-Sn microsoldering (bonding heat tool temp. 523 K and time is 5 sec.) which is applied to the 400 pin count and 0.2 mm lead pitch TCP (Tape Carrier Package) assembling. This method is performed by heat and press tool gang bonding of tin electroplated (6.5 μm thick) copper pattern on substrate and gold electroplated (1.0, μm thick) TCP outer lead with non flux in air. Au-Sn microsoldered layer has the high peel strength and has the high reliability in 423 K storage in air that is higher than Sn-37 mass%Pb microsoldering. And the organic glass-epoxy (FR-4) substrate is not damaged after the Au-Sn microsoldering.

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