接合界面におけるめっき層の組織と接合性に及ぼすめっき浴組成の影響
マイクロパラレルシーム接合法とその接合機器の開発(第3報)
1988 年 6 巻 4 号 p. 571-578
詳細
1988 年 6 巻 4 号 p. 571-578
Experimental evaluation of hermeticity and joining strength and an investigation of joints by SEM, EPMA, AES, were accomplished on hermetically sealed package by Micro-Parallel Seam Joining (MPSJ) using a lid (Fe-Ni-Co alloy) normally applied as hermetic seal of ceramic package for highly reliable LSI, nickel plated in both Watts Bath and Sulfamate Bath. The results are summarized as follows.
(1) Crack was observed at the grain boundary in a plating layer at the joining interface of ceramic package which was hermetically sealed with use of nickle plated lid in a Sulfamate Bath. The crack is considered to be caused by sulfur segregation at the grain boundary from the result of investigation by SEM and AES. As a result, both hermeticity and joining strength were unsatisfactory.
(2) Tendency of crack occurrence was observed to be especially notable at the seam joint after thermal cycling test performed to evaluate reliability of joint rather than immediately after joining. Therefore, thermal cycling test is considered to be an effective means for evaluation of crack occurrence.
(3) Crack was not observed at the joining interface of hermetically sealed package using nickel plated lid in a Watts Bath and indicated to be a sound joint structure. Both hermeticity and joining strength were resulted to be satisfactory. However, peeling of plated layer at an area of the lid slightly away from the joining section was observed on a lid applied with thick plating of 10μm. Therefore, plating thickness of approximately 3.5μm in a Watts Bath is considered to be adequate.
(4) Correlation between hermeticity and peel strength was not found on package hermetically sealed with use of nickel plated lid in a Sulfamate Bath. Although specified value for hermeticity was satisfied, peel strength was zero or a value close to zero on some specimens. Therefore, both methods are required to be performed as an evaluation method for joint of hermetically sealed package by MPSJ method.
