1989 年 7 巻 4 号 p. 425-431
Micro-parallel seam joining equipment provided with multiple functions was newly developed based on experimental results as previously reported to facilitate establishment of seam joining conditions over a wider range for hermetic sealing of ceramic packages of a highly reliable integrated circuit which are becoming larger in size and diversified.
It has also enabled the reinforcement of product quality assurance system as regards to hermeticity, seam joining strength and package temperature rise.
Listed below are the summary of major functions.
(1) In order to prevent damaging the lid due to misalignment or improper positioning of package and lid, inprocess displacement monitor was developed and the performance as calculated was obtained.
(2) The equipment was systemized with use of CPU whereby complex seam joining conditions can be easily entered and also they can be verified as well as stored.
(3) Introducing travelling mechanism which is able to travel to any location on the work table, range of seam joining head travel (X Axis) and the work table travel (Y, Theta Axis) were expanded by a factor of 1.5 to 3 times as compared with the experimental equipment and yet positioning accuracy was improved by a factor of tenth.
(4) A desired distance can be designated on any axis of X, Y and Theta and allow travelling as same joining condition changed for that designated distance (Pitch Feed Function). As a result, prevention of splash generation around the corner section of specially shaped package was achieved as well as suppression of package temperature rise. At the same time, formation of reactive layer due to Au and Ni plated layer melting together was positively achieved at the joining boundary of lid and seal frame and specified hermeticity and joining strength were secured.