1991 Volume 9 Issue 4 Pages 519-525
The contact angle of molten Cu-Ti alloys containing Ti content up to 60 at% or more on SiC was investigated by a sessile drop technique at 1373 K in vacuum.
The contact angle of molten Cu-Ti alloys reaches the equilibrium value at 3.6 ks at 1373 K. The equilibrium contact angle of Cu-Ti alloys on SiC reduces drastically with increasing Ti content. Cu -Ti alloys containing Ti content of 30 at% or more shows the equilibrium contact angle of 7 degree or below. The addition of Ti to copper depresses the reaction of Cu with SiC forming TiC and Ti3SiC2 carbides at SiC/Cu-Ti interface. This accounts for the superior wetting of the Cu-Ti alloys on SiC. The Cu-Ti alloys are applicable to the filler for joining SiC.