抄録
Direct copper deposition on glass without etching is difficult to obtain by the conventional electroless copper treatment process. The formation of copper films on glass without exfoliation of copper from the glass substrate can be accomplished by introducing an alcohol treatment after the conventional sensitization and activation steps. This was followed by the electroless copper deposition.
Adhesion strength was improved by heat treatment under an inert atmosphere. Furthermore, copper circuit patterns with widths of 4 to 6μm were formed by the semi-additive process.
