表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
溶液フロー型液滴セルによる樹脂上への局部銅めっきと金属構造体の作製
坂入 正敏後藤 良仁菊地 竜也伏見 公志
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2011 年 62 巻 10 号 p. 511

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A solution flow type microdroplet cell was applied to form a local copper line on a non-conductive substrate such as epoxy resin. During copper deposition, a copper rod was mounted in the epoxy resin as an electric feeding point. Such a copper line, which can be formed on the epoxy resin on flat and curved surfaces, can be removed from the epoxy resin, suggesting that this technique is applicable to form metal microstructures. The influence of the stage moving speed and applied current on the copper line thickness, shape, and conductivity were also investigated.

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© 2011 一般社団法人 表面技術協会
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