2013 年 64 巻 12 号 p. 682-684
For the direct electroless deposition of adhesive metal films on Si substrates, we have developed a surface-activation process that forms metal nanorods in Si using electroless displacement metal nanoparticle deposition, metal-nanoparticle-assisted HF etching of Si, and autocatalytic electroless Ni deposition. The metal film adhesion increases with the metal nanorod length.