表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
無電解析出プロセスにおける還元剤BH4に対するCu及びPd表面の触媒作用機構の理論的解析
國本 雅宏中井 浩巳本間 敬之
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ジャーナル フリー

2015 年 66 巻 12 号 p. 666-669

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To elucidate the catalytic reaction mechanism of BH4 (a reducing agent) on metal surfaces during electroless deposition, its oxidation reaction was investigated theoretically using density functional theory (DFT) calculation. Particularly in this study, dehydrogenation reaction of BH4 was modeled and analyzed because it is the most important elementary step of overall oxidation for the catalytic behavior of metal surfaces. To ascertain the tendencies of catalytic activity of metal surfaces, the reaction on Cu(111) and that on Pd(111) were compared. Actually, Cu shows little catalytic activity toward BH4 oxidation, whereas Pd shows strong catalytic activity. Results of reaction energy calculations show that the BH4 dehydrogenation occurs with difficulty on Cu(111), but it occurs easily on Pd(111), which corresponds to experimental results. Detailed analyses of reaction system electronic structures show that the d-band states of each surface are important to assess the background of the difference. Because the Pd surface has a high-energy d-band, it can interact with high-energy unoccupied orbitals of BH4, leading to electron donation from the surface toward BH4. This electron donation effect from Pd provides dissociation activity of the B-H bond, which promotes dehydrogenation of BH4.

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