Porous alumina was prepared by anodizing electrochemically deposited aluminum（Al）films in an acidic aqueous solution. The Al films were electrodeposited on copper plates from ionic liquid baths containing Al3+ ions. AlCl3-trimethylphenylammonium chloride (TMPAC), AlCl3- 1-ethyl-3-methylimidazolium chloride (EMIC), and Al3Cl-1-butyl-1-methylpyrrolidium chloride (BPC) were used as ionic liquid baths for Al electroplating. The Al film deposited from the AlCl3-EMIC bath was the thickest among the films obtained from baths. The Al films plated from ionic liquid baths were then anodized at 40 V in 0.8 M oxalic acid aqueous solution at 16 °C for 4 h to form porous alumina films, which showed arrayed pores of the same diameter in arrangements that were mutually parallel and perpendicular to the substrate surface. The average hole period was 99-106 nm.