表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
研究論文
低真空CuスパッタによるPBT樹脂へのメタライジング
山岸 俊通井上 智明猿渡 哲也渡邊 充広
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2021 年 72 巻 4 号 p. 225-229

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Plating on engineering plastics is necessary as an alternative to metallic materials for weight reduction and design improvement. However, harmful chemical substances are involved in plastic plating processes. For this study, we specifically assessed polybutylene terephthalate(PBT)as a metal substitute material and examined low-vacuum Cu sputtering. Along with fatigue resistance, heat resistance, and electrical characteristics, PBT has particularly good water absorption resistance and therefore excellent dimensional stability. Because of these characteristics, PBT has attracted attention as a metal substitute material. Low-vacuum Cu sputter is excellent for metal deposition on a three-dimensional object because particles from the target are scattered in a low vacuum. For this study, we examined improvement of the adhesion of Cu sputter to PBT by applying oxygen plasma treatment as a sputter pretreatment.

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