Studies on Etching of Copper Plate with Nitric Acid

Abstract

Cu plate for printing is generally etched with ferric chloride. In place of ferric chloride, we used nitric acid which is cheaper, and could measure the degree of deterioration more easily. We found that 20% HNO₃ solution containing 4 to 5% NaNO₂ had more excellent etching rate than 38° Be FeCl₃ solution. However, it appears that 10% HNO₃ solution containing 5% NaNO₂ is more suitable for actual etching of Cu plate for printing.