表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
結晶化ガラスへの銅めっき
津山 宏一岡村 寿郎中山 肇
著者情報
ジャーナル フリー

1990 年 41 巻 4 号 p. 442-445

詳細
抄録

A process of plating copper on devitrified porcelain enamel printed circuit boards has been developed, the essential feature of which is the pretreatment of the porcelain surface with fluoride solution, catalysis with an organic solution, and electroless copper plating. A fully practical pull strength of 2-3kgf/mm2 was achieved for plated copper.
This makes possible the copper, plating of through holes, formation of conductors and fine patterning with line widths of about 50μm width on porcelain enamel printed circuit boards.

著者関連情報
© (社)表面技術協会
前の記事 次の記事
feedback
Top