グリオキシル酸を還元剤とする無電解銅めっき
1991 年 42 巻 9 号 p. 913-917
詳細
1991 年 42 巻 9 号 p. 913-917
The use of glyoxylic acid as an alternative reducing agent to formaldehyde for electroless copper plating was investigated. Plating rates were considerably faster and bath stability was superior to formaldehyde baths under standard operating conditions. The morphologies of the deposited copper were not greatly affected by EDTA concentration, and good mechanical properties of the deposition were obtained. The rate of the Cannizaro reaction with glyoxylate ions was faster than that with formaldehyde, but could be reduced by 10 to 40% using KOH in place of NaOH. It was confirmed that deposition unformity of hole wall coverage was superior to that of the formaldehyde bath. Glyoxylic acid is a nonvolatile chemical that showed good reducing power in electroless copper plating, and can therefore replace formaldehyde, alleviating environmental problems.
