The throwing power of Cu (II)-ethylenediamine complex plating baths and the mechanical properties of the films obtained were investigated.
The addition of ammonium sulfate and glycine was found to increase specific conductivity and polarization resistance, resulting in an increase in throwing power. The further addition of a small quantity of thiodiglycollic acid to the baths resulted in an increase in the elongation and contributed to the brighting of the films.
Under suitable conditions, the films obtained were shown to have the same elongation and ultimate tensile strength as commercial high-ductile electrolytic copper films.
