Ti合金上のNiめっき皮膜密着性に及ぼす熱処理の効果

抄録

To improve adhesive properties, we developed a nickel electroplating process for modifying the surface of titanium substrate. This process involves copper-strike and nickel plating followed by heat treatment in a vacuum to ensure the mutual diffusion of Ni, Cu and Ti in low temperature ranges, e.g., 823K. This process provided a titanium/nickel interface having exellent adhesion. Diffusion treatment in a vacuum after nickel plating builds up intermetallic compounds such as TiNi₃, TiNi, Ti₂Ni and Cu₄Ti at the interface between titanium and plated Ni and Cu, leading to a property with a gentle change from substrate to nickel. It was eventually confirmed that the process gaul superior adhesive properties on Ti substrate to conventional process.