表面技術
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
カチオン交換膜を用いる電気Ni-P合金めっきプロセスの検討
森河 務横井 昌幸中出 卓男福本 幸男岩倉 千秋
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1995 年 46 巻 7 号 p. 653-658

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Continuous Ni-P alloy plating without any effluence of waste plating solution was studied using a plating cell divided into cathode and anode compartments with a cation exchange membrane and introducing a dimensionally stable anode. Nickel and hydrogen ions reduced in the plating reaction could be replenished by those invading through the membrane from the anode compartment. The replenishment rate of these ions, which depends on their concentration ratio in the anolyte, was maintained at a suitable value by the reasonable distribution of the anodic current to the nickel anode and a dimensionally stable anode. In addition to replenishment through membrane, the continuous addition of phosphorous acid to the catholyte resulted in the constant composition of the plating solution and thus the constant composition of deposited films.

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