自己触媒型無電解スズめっきの析出速度に及ぼす添加剤の効果

抄録

Effects of additives on the deposition rate of autocatalytic tin plating were studied for the bath using TiCl₃ as a reducing agent. The deposition rate was greatly increased by adding either Ca or Mg to the bath, while drastically decreased by Tl or Sb. Other additives examined, i.e. Zn, Ni, Sr, Mn, Ba, Fe, Al and Sn had no effects on the rate. It was also found desirable to add Ca and Mg as chlorides, iodides, bromides, sulfates, acetates and phosphinates for increasing the deposition rate, whereas not desirable, as nitrates.