高比抵抗無電解NiP薄膜の熱安定性
1997 年 48 巻 4 号 p. 476-477
詳細
1997 年 48 巻 4 号 p. 476-477
We investigated the 200°C annealing effect on high-resistivity electroless NiPC film containing 2.8at% carbon. In the step stress test for thermal stability, Film B of NiPC annealed at 200°C was 1, 280μΩcm, and showed almost no change in resistance even at low annealing temperature.
