The properties of electrodeposited silver films from succinimide baths were iuvestigated using a bath composed of 0.45mol/L of CH3SO3Ag and 1.5mol/L of succinimide. The silver film grain size was similar to that from a bright cyanide bath. The optimum conditions for bright silver plating were a pH of 10, a bath temperature of 25°C, and a current density of 2A/dm2.
The plating bath throwing power was 40-42% and increased with the pH. The solderability of these silver deposits was better than those from a bright cyanide bath and the film electric contact resistance was less than 2mΩ at a load of 5g. The deposited silver hardness was Hv (125-130) and became Hv (86-90) after backing at 200°C for 1h.