鉄-タングステン系合金めっき膜の非晶質化に及ぼすコバルトおよびニッケルの影響

抄録

We used X-ray diffraction to study the effects of cobalt and nickel on electrodeposited iron-tungsten-based alloy film amorphization. The minimum tungsten content required for amorphization decreased from ca 13at% in iron-tungsten binary alloys to ca 4at% or ca 7at% in ternary alloys with cobalt or nickel. A ternary alloy structure with a tungsten content less than that required for amorphization tends to be influenced by the substrate surface structure and to be stable only at low temperature. This appears to be why ternary alloys with cobalt or nickel with lower tungsten content become amorphous than iron-tungsten binary alloy.